Copper Clad Laminates
 Technical Papers
 
Process Technology
1. Lead Free Solution
2. Anti-CAF conductive anodic filament CCL material
3. High Performance Halogen Free Laminate
4. High Performance Laminate For IC Substrate
5. High Tg Halogen free for PWB Application
6. Novel Modify Epoxy High Tg Laminate For PCB
7. High Tg And Low Dk Laminate For Next Generation Printed Wiring Board
8. Resin Coated Copper Foils For Building Up PCB
9. Halogen-Free Material For PWB Applications
10. Anti-CAF “Conductive Anodic Filament” CCL Material
11. The Challenges of Higher Temperature Lead Free Process
12. Lead Free 高溫製程的挑戰
13. 無鉛製程時代如何選擇適當板材因應高溫組裝需求
 
 
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Tel : 886-2-27178504
Fax : 886-2-27182258
Mr. Stephen Chang (Ext: 8504)
Email : stephenchang@npc.com.tw
Mr. Daniel Fu
Email : danielfu@npc.com.tw
Mr. Jack Lin
Email : 28e00@npc.com.tw
       
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