製程介紹

Copper dissolving stang：
Immerse the copper Wire in the mixture of sulfuric acid and water, agitate with air to dissolve copper, the copper sulfate solution then filtered completely and become as the electrolyte。

Copper foil forming stage：
Apply the DC current through the electrolyte in the electrolytic cell, copper foil will be deposited on the surface of the turning roller (cathode) The copper foil then peeled, scrolled as copper foil coil.。

After treatment of copper foil：
The copper foil need to go through certain after treatment to make them ideal for the copper foil laminated substrate for PCB.The after treatment and their purposes were described as the following：

Roughing treatment：
	To increase the adhesion in between the copper foil and the resin in the substrate
Heat resistance treatment：
	To increase the heat resistance of the copper foil.
Anti-oxidation treatment：
	To increase the anti-oxidation resistance of copper foil.

Cutting and packaging：
Treated copper foil will go through inspection, cutting into regular sizes, packaging, then stocking in ware house, ready for delivery。