Nan Ya CCL Technology Roadmap

Product in Development

2009

2010

2011

2012

Remark

Q1

Q2

Q3

Q4

Q1

Q2

Q3

Q4

Q1

Q2

Q3

Q4

Q1

Q2

Q3

Q4

High Tg/
Low CTE
Materials

NPG-180(Z-α2:160↓)

C

D

D

D

IC substrates

Halogen free Low CTE
(Z-α2:120↓)

C

C

C

D

D

D

Low CTE Solution

Halogen free ultra
Low CTE (Z-α2:100↓)

B

B

B

C

C

C

D

D

D

High density I/O count IC substrates

Low Dk/Df
Materials

High frequency material
(Dk:3.5↓, Df 0.008 ↓)

B

B

B

C

C

C

D

D

D

LD glass cloth Middle profile copper

Halogen
Free
Materials

Halogen free Low Dk I
(Dk:4.2↓, Df 0.010 ↓)

A

A

A

B

B

B

C

C

C

D

D

D

High frequency and halogen free

Halogen free Low Dk Ⅱ
(Dk:4.0↓, Df 0.008 ↓)

A

A

A

B

B

B

C

C

C

D

D

Higher frequency

Halogen free Low Dk Ⅲ
(Dk:3.8↓, Df 0.006 ↓)

A

A

A

B

B

B

C

C

High speed and High reliability

Specialty
Materials

Halogen free
Semi- Flexible

B

C

C

C

D

D

D

Bendable material

Thermal Conductivity
(2.0~3.0 W/m.k)

B

B

C

C

C

D

D

D

For thermal management

Thermal Conductivity
(5.0 W/m.k ↑)

A

A

A

B

B

B

B

C

C

C

C

High thermal management

Profile free copper

A

A

A

B

B

B

B

C

C

C

For fine line

Thin core

30 μm thin core

A

A

A

B

B

B

C

C

C

D

D

D

Thinner HDI

25 μm thin core

A

A

A

B

B

B

C

C

C

D

D

Thinner HDI