Resin Coated Copper Foil
FEATURES
Ÿ Higher glass transition temperature
Ÿ Excellent filling ability
Ÿ Lower dielectric constant
Ÿ Thin dielectric and light weight
Ÿ Easy to drill by CO2 laser
Ÿ Even surface for fine line and space usage
Ÿ Traditional FR-4 processability
Ÿ UL File number E98983(s)
 
PRODUCT THICKNESS
CHARACTERISTICS
UNIT
TYPICAL VALUES
Copper
μm
12 (3/8 oz)
18 (1/2 oz)
36 (1 oz)
Resin Thickness
μm
35 - 110
 
PERFORMANCE LIST
CHARACTERISTICS
UNIT
CONDITIONING
TYPICAL VALUES
Glass Transition Temperature
℃
TMA
160±5
℃
DSC
180±5

Coefficient of Thermal Expansion(Before Tg)
In/in/℃
TMA
6x10-5~9x10-5
Surface Flatness
μm
-
2-3
Flammability
-
C-24/23/50+E-24/125
V-0
Peel Strength H oz
lb/in
288℃´10” solder dipping
7-8
Thermal Stress
SEC
288℃ solder dipping
120 ­
Permittivity 1MHZ
-
C-24/23/50
3.6-3.8
Loss Tangent 1MHZ
-
C-24/23/50
0.02-0.04
Surface Resistivity
MΩ
C-96/35/90
1.0´1011
Volume Resistivity
MΩ-cm
C-96/35/90
3.0´1012
Data shown are nominal values for reference only.
 
DIELECTRIC CONSTANT AND DISSIPATION FACTOR
A. Dielectric Constant ( εr )
1MHz
2MHz
5MHz
10MHz
100MHz
500MHz
1GHz
FR4 -1.6
4.6007
4.5509
4.4014
4.3561
4.2628
4.1641
4.1101
NPRCC
3.7453
3.6973
3.5533
3.4827
3.332
3.2497
3.2231
 
Test Condition : C-24/23/50

B. Dissipation Factor (tand)
1MHz
2MHz
5MHz
10MHz
100MHz
500MHz
1GHz
FR4 -1.6
0.042751
0.037166
0.020411
0.01491
0.011922
0.00887
0.011303
NPRCC
0.0392
0.0373
0.031599
0.028771
0.020463
0.016398
0.016504
Test Condition : C-24/23/50
Measurement Equipment : RF Impedance/Material Analyzer 4291A (Hewlett Packard)
 
THE MANNER OF LAY-UP
 

LAMINATION
Recommended press cycles :
A. 2T2P (2 temperature step / 2 pressure step)
 
 
B. 1T2P (1 temperature step / 2 pressure step)
 
 
C. Vacuum
Vacuum (mmHg)
Time (min)
step 1
760
0
step 2
≦50
1-5
step 3
≦50
40-60
 
Suggestions:
1.
Heating rate of material between 70℃ and 140℃, 1-3℃/min is acceptable.
2.
Temperature of material over 170℃ must be held for at least 40 min to allow epoxy resin to fully cure.
3.
Cooling rate of material should be kept under 2.5℃/min when the temperature of material is over 100℃, in order to avoid introducing twist.
4.
A vacuum of less than 50 mmHg will be needed to eliminate voids.