| W2 |
5~7min.
@85~115°C
(Hot Air Dryer) |
‧Vertical Gravure
Roller Coater
‧Acidic Etching |
‧Non-Filler
‧Stackable over 48 hours
‧Fast exposure speed
‧Superior resistance to mechanical and handling damage
‧Superior roller wetting efficiency |
PCB、HDI、BGA、Flip chip、CSP、Lead Frame。 |
| W5L |
5~7min.
@85~105°C
(Hot Air Dryer) |
‧Vertical Gravure
Roller Coater
‧Acidic Etching |
‧Filler
‧Stackable over 48 hours
‧Fast exposure speed
‧No precipitation on storage |
PCB、HDI、BGA、Flip chip、CSP、Lead Frame。 |
| W5 |
40~60sec.
@85~105°C
(IR or Hot Air Dryer) |
‧Horizonal Gravure
Roller Coater
‧Acidic Etching |
‧Filler
‧Stackable over 48 hours
‧Fast exposure speed
‧No precipitation on storage |
PCB、HDI、BGA、Flip chip、CSP、Lead Frame。 |
| W8 |
45~60sec.
@90~110°C
(IR or Hot Air Dryer) |
‧Horizonal Gravure
Roller Coater
‧Acidic Etching |
‧Non-Filler
‧Stackable over 48 hours
‧Acidic Etching
‧Fast exposure speed
‧Superior resistance to mechanical and handling damage |
PCB、HDI、BGA、Flip chip、CSP、Lead Frame。 |
