铜箔基板(Copper clad laminate(CCL))
- 布、纸组合覆铜板(CEM-1-97)(Epoxide Cellulose Paper Core,Glass Cloth Surfaces CCL)
- 布、席组合覆铜板(CEM-3-92/CEM-3-98)(Epoxide Cellulose MAT Core,Glass Cloth Surfaces CCL)
- 散热布、席组合覆铜板(CEM-3-09HT)(Thermal Conductivity CEM-3)
- 无卤素散热CEM-3覆铜板(CEM-3-01HC)(Halogen Free Thermal Conductivity CEM-3)
- 耐燃硬质覆铜板(FR-4-86 UV Block)(Conventional FR-4, FR-5)
- 耐燃多功能覆铜板(NP-140)(Firing resistance multifuntional Rigid CCL)
- Tg 150℃多功能覆铜板(NP-150)(Tg 150℃ multifuntional Rigid CCL)
- 无卤素Tg 150℃无铅覆铜板(NPG-150N)(Halogen Free, Lead Free Compatible)
- 无铅Tg 155℃硬质覆铜板(NP-155F)(Lead Free CCL)
- 无铅Tg 175℃低膨胀硬质覆铜板(NP-175F)(Lead Free Tg 175℃ Low CTE Rigid CCL)
- 无卤素Tg 170℃无铅覆铜板(NPG-170N)(Halogen Free Tg 170℃ Lead Free CCL)
- 无卤素Tg 150℃高刚性低介电覆铜板 (NPGN-150LKHD)(Halogen Free Tg 150℃ Stiffness Low Loss Rigid CCL)
- 无卤素Tg 170℃低介电覆铜板(NPG-171)(Halogen Free Tg 170℃ Low Loss CCL)
- 无卤高Tg高频低介电覆铜板(NPG-170D)(Halogen Free High Tg High Frequency Low Loss CCL)
- 无卤素Tg 150℃高刚性覆铜板(NPG-151)(Halogen Free Tg 150℃ Stiffness CCL)
- 无铅Tg 175℃低膨胀高信赖性硬质覆铜板 (NP175FBH)(Lead Free Tg 175℃ Low CTE High Reliability Rigid CCL)
- 无卤素Tg 180℃硬质覆铜板(NPG-180)(Halogen Free IC Substrate)
- 无卤素Tg 200℃ BT硬质覆铜板(NPG-200)(Halogen Free Tg 200℃ BT Rigid CCL)
- 无铅Tg 175℃低膨胀硬质覆铜板(质量提升) (NP-175FM)(Lead-free Tg 175℃Low CTE Rigid CCL(Quality Improvement))