Products

Copper Foils for FPC Application

Applications:

Printed circuit board


Details

1. The copper plate with the main specifications is from 9μm to 70μm.

2. Product species:NPV, VF series suitable coating process.

3. Product species:VFM series suitable lamination process.

4. Etched with good and excellent flex workability.

5. Ultra-low surface roughness and high bonding strength.

Use

Applied to FCCL materials and for flexible printed circuit boards (2-Layer, 3-Layer)

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Copper Foils for FPC Application