Products

Ultra Thin Copper Foil

Applications:

Printed circuit board


Details

1. The ultra-thin copper foil main specifications is from 2μm to 5μm.

2. Product species: NPU, NPUE,CL series, with a very low surface roughness, easy tear-off and excellent etching resistance (L / S 30/30).

3. Product species :CL series, applied to coreless process.

Use

Applied to IC board, Coreless process and other use of the material for the printed circuit board (PCB) manufacturing, including IC board, Coreless substrates.

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Ultra Thin Copper Foil