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Copper Foils for FPC Application

Applications：

Printed circuit board

Certificate / Catalogue：

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Details

1. The copper plate with the main specifications is from 9μm to 70μm.

2. Product species：NPV, VF series suitable coating process.

3. Product species：VFM series suitable lamination process.

4. Etched with good and excellent flex workability.

5. Ultra-low surface roughness and high bonding strength.

Use

Applied to FCCL materials and for flexible printed circuit boards (2-Layer, 3-Layer)

(NAN YA，Apr 29, 2016)

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Copper Foils for FPC Application

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