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Ultra Thin Copper Foil

Applications：

Printed circuit board

Certificate / Catalogue：

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Details

1. The ultra-thin copper foil main specifications is from 2μm to 5μm.

2. Product species： NPU, NPUE,CL series, with a very low surface roughness, easy tear-off and excellent etching resistance (L / S 30/30).

3. Product species ：CL series, applied to coreless process.

Use

Applied to IC board, Coreless process and other use of the material for the printed circuit board (PCB) manufacturing, including IC board, Coreless substrates.

(NAN YA，Apr 29, 2016)

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Ultra Thin Copper Foil

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