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Copper Foils for High Frequency Application

Applications:

Printed circuit board


Details

1. High Frequency copper foil substrate main specifications is from 12μm to 70μm.

2. Product species:TLC-V, TLC-H series.

3. Has a very low surface roughness and high peel strength.

Use

Applied to low dielectric (Low Dk / Df), communications and other use of the material for the printed circuit board (PCB) manufacturing, including FR-4, FR-5, and other CCL.

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Copper Foils for High Frequency Application